Expert Reports

almit Expert report- Contactless soldering with laser beam

almit Expert report- Contactless soldering with laser beam

Laser soldering has established itself as a single soldering process in recent years and
increasingly replaces conventional soldering processes. Nevertheless laser soldering
is expensive and the large advantages of laser soldering also present disadvantages.
With the correct laser soldering technique the costs are under control and the disadvantages
can largely be removed. In this case solder and soldering flux are of decisive
importance.
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Flux types in accordance with IPC-J-STD-004 88

Flux Types in accordance with IPC-J-STD-004

IPC is a global trade association dedicated to the competitive excellence and fi nancial success of
its member companies which represent all facets of the electronics interconnect industry, including
design, printed circuit board manufacturing and electronics assembly.
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Preventing reliability problems in soft soldering

Preventing reliability problems in soft soldering

Even the use of high-quality solder does not guarantee that solder joints are always of consistent
and uniform quality.
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Soldering peaks and service life

Soldering peaks and service life

With an increase in thickness of the iron layer we achieve a reduction in the thermal transfer behaviour at the same time. With an attempt to compensate this by increasing temperature the situation would be signifi cantly worsened.

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The importance of protection against humidity for circuit boards

The importance of protection against humidity for circuit boards

It is common knowledge that SMD components such as QFP’s, BGA’s are sensitive to moisture however LED’s and ceramic capacitors are too.

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Vacuum reflow soldering – the simple solution for pore reduction

Vacuum reflow soldering – the simple solution for pore reduction

The simple solution for pore reduction in soldering points In the course of production of increasingly more complex and efficient electronics, such as for example new hybrid components for the automotive sector, low-porosity solder points are required that cannot be produced with conventional reflow technology.

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